IT-8338G
IT-8338G 是一種高階Ultra-Low Loss (ULL) & High Tg (185°C by TMA)材料用於高要求射頻(RF)應用。這支材料擁有介電常數(Dk) 3.38 被設計用於5G基地台mmWave應用,功率放大器、天線、76-81 GHz汽車雷達及其他RF應用。這支產品提供比纖維增強碳氫化合物材料較佳的耗散因數和插入損失。這個產品可搭配全整PP用於高信賴性多層板或和其他ITEQ材料混壓。
下一世代無鹵產品應用
5G 基地台& mmWave應用
功率放大器、天線應用
76-81 GHz汽車雷達
重要特性
Low Dk 3.38 at 10 GHz & Low Df 0.0023 at 10 GHz
Excellent dimensional stability
Very stable DK/Df with Temperature
Ability to use very low profile Copper for reduced insertion loss
Highly suitable for Hybrids, Ability to make high layer count boards
Full prepreg offering, Compatible with modified FR-4 processes
性能
Items | Methods | IT-8338G |
Tg (℃) | TMA | 185 |
T288 (with 1 oz Cu), min | TMA | >60 |
Td-5 %( ℃) | TGA | 430 |
CTE (ppm/℃) | a1/a2 | 60/350 |
CTE (%), 50-260℃ | TMA | 3.4 |
Dk @ 10 GHz | TM-mode,CDR C-24/23/50 | 3.38 |
Df @ 10 GHz | TM-mode,CDR C-24/23/50 | 0.0023 |
*樣品厚度 : 0.508 mm
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IT-8350G
IT-8350G是一種高階High Tg (185°C by TMA) Ultra-Low Loss (ULL)材料可用於高要求(RF)應用。這支材料擁有介電常數(Dk) 3.48被設計用於5G基地台, mmWave 應用、功率放大器、天線、76-81 GHz汽車雷達和RF應用。這支產品提供比增強碳氫化合物材料較佳的耗散因數和插入損失。這個產品可搭配全整PP用於高信賴性多層板或和其他ITEQ材料混壓。
下一世代無鹵產品應用
5G基地台& mmWave應用
功率放大器、天線應用
76-81 GHz汽車雷達
重要特性
Low Dk 3.48 at 10 GHz & Low Df 0.0025 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids, ability to make high layer count boards
Full Prepreg offering, compatible with modified FR-4 processes
性能
Items | Methods | IT-8350G |
Tg (℃) | TMA | 185 |
T288 (with 1 oz Cu), min | TMA | >60 |
Td-5 %( ℃) | TGA | 430 |
CTE (ppm/℃) | a1/a2 | 55/290 |
CTE (%), 50-260℃ | TMA | 2.8 |
Dk @ 10 GHz | TM-mode,CDR C-24/23/50 | 3.48 |
Df @ 10 GHz | TM-mode,CDR C-24/23/50 | 0.0025 |
*樣品厚度 : 0.508 mm
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IT-88GMW
IT-88GMW是一種高階Ultra-Low Loss (ULL) & High Tg (185°C by TMA)材料用於高要求射頻(RF)應用。該材料設計用於在 76-81 GHz 頻率範圍內運行的自動駕駛或高級駕駛輔助系統 (ADAS) 的遠程 (LRR)、短程 (SRR) 和中程雷達 (MRR)。該產品提供與 PTFE 產品相同的損耗因數和插入損耗。其較高的彈性模量有助於減少混合應用中的mismatch。此產品被預計在毫米波頻率範圍內工作,並且需要高功率處理能力,適用於高要求5G基地台、功率放大器及天線應用。該產品可以與完整的 Prepre 產品配對,以構建高可靠性的板板。介電性能隨溫度變化非常穩定,因此非常適合汽車領域熱循環要求。
下一世代無鹵產品應用
5G 基地台& mmWave應用
功率放大器
天線應用
76-81 GHz汽車雷達
點對點微波鏈結
航天應用
重要特性
Low Dk 3.02 at 10 GHz & Low Df 0.0013 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids, ability to make high layer count boards
Full Prepreg offering, compatible with modified FR-4 processes
性能
Items | Methods | IT-88GMW |
Tg (℃) | TMA | 185 |
T288 (with 1 oz Cu), min | TMA | >60 |
Td-5 %( ℃ ) | TGA | 425 |
CTE (ppm/℃) | a1/a2 | 70/400 |
CTE (%), 50-260℃ | TMA | 3.9 |
Dk @ 10 GHz | TM-mode,CDR C-24/23/50 | 3.02 |
Df @ 10 GHz | TM-mode,CDR C-24/23/50 | 0.0013 |
*樣品厚度 : 0.508 mm
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IT-8350B
IT-8350B是一種高階Ultra-Low Loss (ULL)材料可用於高要求的(RF)應用。這支材料擁有介電常數(Dk) 3.49被設計用於5G基地台, mmWave 應用、功率放大器、天線、76-81 GHz汽車雷達和RF應用。這支產品提供纖維比增強碳氫化合物材料較佳的耗散因數和插入損失。
應用
5G 基地台& mmWave應用
功率放大器、天線應用
76-81 GHz汽車雷達
重要特性
Low Dk 3.49 at 10 GHz & Low Df 0.0025 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids, ability to make high layer count boards
性能
Items | Methods | IT-8350B |
T288 (with 1 oz Cu), min | TMA | >60 |
Td-5 %( ℃ ) | TGA | 400 |
CTE (ppm/℃) | a1/a2 | 60/180 |
CTE (%), 50-260℃ | TMA | 2.3 |
Dk @ 10 GHz | TM-mode, CDR C-24/23/50 | 3.49 |
Df @ 10 GHz | TM-mode, CDR C-24/23/50 | 0.0025 |
*樣品厚度 : 0.762 mm
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IT-8350T
IT-8350T是一種Ultra-Low Loss (ULL)材料。這支材料具有高熱傳導係數,被設計用於高功率及要求更高的最高工作溫度的工業加熱應用。
應用
高功率射頻和微波功率放大器
應用於工業加熱的高功率放大器
無元原件:例如耦合器、濾波器及功率分配器
重要特性
Low Dk 3.49 at 10 GHz & Low Df 0.0025 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids, ability to make high layer count boards
性能
Items | Methods | IT-8350T |
T288 (with 1 oz Cu), min | TMA | >60 |
Td-5 %( ℃ ) | TGA | 380 |
Thermal Conductivity (W/mK) | ASTM D5470 | 0.9 |
CTE (%), 50-260℃ | TMA | 2.0 |
Dk @ 10 GHz | TM-mode, CDR C-24/23/50 | 3.51 |
Df @ 10 GHz | TM-mode, CDR C-24/23/50 | 0.0017 |
*樣品厚度 : 0.762 mm
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IT-8300GA
IT-8300GA是一種高階Ultra-Low Loss(ULL)&High Tg(200°C by TMA)材料用於高要求射頻(RF)應用。這支材料擁有介電常數(Dk) 3.00被設計用於5G基地台、mmWave應用、天線及其他RF應用。這支產品提供比纖維增強碳氫化合物材料較佳的耗散因數和插入損失。這個產品可搭配全整PP用於高信賴性多層板或和其他ITEQ材料混壓。
下一世代無鹵產品應用
5G基地台& mmWave應用
天線應用
重要特性
Low Dk 3.00 at 10 GHz & Low Df 0.0026 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids, ability to make high layer count boards
Full Prepreg offering, compatible with modified FR-4 processes
性能
Items | Methods | IT-8300GA |
Tg (℃) | TMA | 200 |
T-300 (w/ 1 oz Cu, min) | TMA | >60 |
Td-5%(℃) | TGA 5% loss | 430 |
CTE (ppm/℃) | a1/a2 | 40/140 |
CTE (%), 50-260℃ | TMA | 1.7 |
Dk @ 10 GHz | TM-mode,CDR C-24/23/50 | 3.0 |
Df @ 10 GHz | TM-mode,CDR C-24/23/50 | 0.0026 |
*樣品厚度 : 0.76mm.
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IT-8615G
IT-8615G 是一種高階High Tg (205°C by TMA) Ultra-Low Loss (ULL)材料可用於高要求(RF)應用。這支材料擁有介電常數(Dk)6.15被設計用於5G基地台, mmWave 應用、天線和其他RF應用。這支產品提供比增強碳氫化合物材料較佳的耗散因數和插入損失。這個產品可搭配全整PP用於高信賴性多層板或和其他ITEQ材料混壓。
下一世代無鹵產品應用
5G基地台& mmWave應用
天線應用
重要特性
High Dk 6.14 at 10 GHz & Low Df 0.0038 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids
Ability to make high layer count boards
Full Prepreg offering, compatible with modified FR-4 processes
性能
Items | Methods | IT-8615G |
Tg (℃) | TMA | 205 |
T288 (with 1 oz Cu), min | TMA | >60 |
Td-5%(℃) | TGA | 430 |
CTE (ppm/℃) | a1/a2 | 45/220 |
CTE (%), 50-260℃ | TMA | 1.9 |
Dk @ 10 GHz | TM-mode,CDR C-24/23/50 | 6.14 |
Df @ 10 GHz | TM-mode,CDR C-24/23/50 | 0.0038 |
*樣品厚度 : 0.508 mm
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