IT-958GTC
IT-958GTC
IT-958GTC is a halogen free, High Tg (175° C by DSC), advanced multifunctional epoxy and low loss material. This material has low Dk and low Df performance. IT-958GTC is designed not only for standard multilayer PWBs, but also high speed 3S (Server/Storage/Switch) application.
Application
Server/Storage/Switch
Backplane
Telecom
Base station
Key Features
Advanced high Tg resin technology
Excellent electrical performance
Lower Dk (3.7 @ 10GHz) and low Df (0.007 @ 10GHz)
Stable Dk/Df with different environment
Property
|
Items |
Methods |
IT-958GTC |
|
Tg (℃) |
DSC |
175 |
|
T-288 (w/ 1 Oz Cu, min) |
TMA |
>60 |
|
Td-5%(℃ ) |
TGA 5% loss |
400 |
|
CTE (ppm/℃) |
a1/a2 |
40/230 |
|
CTE (%), 50-260℃ |
TMA |
2.5 |
|
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
3.7 |
|
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.007 |
*The sample thickness : 0.76 mm
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IT-170GRA2TC
IT-170GRA2TC
The IT170GRA2 TC is a high Tg (175° C by DSC), halogen free epoxy and low loss material
with high thermal reliability, low CTE and CAF resistance. This green material is designed
for low lost low loss material and used in server/storage/ switch application .
Application
Server/Storage/Switch
Routers
Backplane
Telecom
Base station
Key Features
Halogen free,high Tg (175 o C)
Lower Dk ( Compatible with High Tg standard FR 4 processes)
High thermal & CAF resistance reliability
Environmental friend ly materials
Property
|
Items |
Methods |
IT-170GRA2TC |
|
Tg (℃) |
DSC |
175 |
|
T-288 (w/ 1 Oz Cu, min) |
TMA |
>60 |
|
Td-5%(℃ ) |
TGA 5% loss |
390 |
|
CTE (ppm/℃) |
a1/a2 |
40/215 |
|
CTE (%), 50-260℃ |
TMA |
2.4 |
|
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
3.8 |
|
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.008 |
*The sample thickness : 0.76 mm
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IT-200LKTC
IT-200LKTC
IT-200LKTC is a low CTE, high Tg (200° C by DSC), multifunctional epoxy and low loss material. This material exhibit low Dk/Df and excellent reliability performance, designed not only for standard multilayer PWBs, but also for 3S(Server/Storage/Switch) application.
Application
Server/Storage/Switch
Backplane
Telecom
Base station
Key Features
Advanced high Tg resin technology
Low Dk (3.66 @ 10GHz) and low Df (0.0083 @ 10GHz)
Stable Dk & Df performance
Excellent reliability performance
Compatible with most FR-4 processes
Property
|
Items |
Methods |
IT-200LKTC |
|
Tg (℃) |
DSC |
200 |
|
T-288 (w/ 1 Oz Cu, min) |
TMA |
>30 |
|
Td-5%(℃ ) |
TGA 5% loss |
370 |
|
CTE (ppm/℃) |
a1/a2 |
40/200 |
|
CTE (%), 50-260℃ |
TMA |
2.5 |
|
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
3.66 |
|
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.0083 |
*The sample thickness : 0.76 mm
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IT-150DATC
IT-150DATC
IT-150DATC is a high Tg (180° C by DSC), advanced multifunctional epoxy and low loss material. This material has low Dk and low Df performance. IT-150DATC is designed not only for standard multilayer PWBs, but also for radar application. This material is also suitable for 3S (Server/Storage/Switch) application.
Application
Server/Storage/Switch
Backplane
Telecom
Base station
Radio Frequency
Key Features
Automotive radar application
Advanced high Tg resin technology
Excellent electrical performance
Lower Dk (3.64 @ 10GHz) and low Df (0.0065 @ 10GHz)
Stable Dk/Df with different environment
Property
|
Items |
Methods |
IT-150DATC |
|
Tg (℃) |
DSC |
180 |
|
T-288 (w/ 1 Oz Cu, min) |
TMA |
>30 |
|
Td-5%(℃ ) |
TGA 5% loss |
370 |
|
CTE (ppm/℃) |
a1/a2 |
45/250 |
|
CTE (%), 50-260℃ |
TMA |
2.6 |
|
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
3.64 |
|
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.0065 |
*The sample thickness : 0.76 mm
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IT-170GLETC
IT-170GLETC
The IT-170GLE is an advanced HDI application, high Tg (170° C by DSC) and low Dk material. This material is designed for high storage modulus application and future any layer PWBs, also for high layer PCB application, like the handheld drive & smart phone, modify BGA board application. Due to the low Dk respectively can stable with high frequency, it is also suitable for halogen free application. IT-170GLETC also exhibit high thermal resistant and CAF reliability.
Application
Smart phone
Tablet
Hand held drive
Like BGA board
Key Features
For LTE, 4G and 5G hand phone solution
Advanced high heat resistance and low CTE technology
Lower Dk (3.14 @ 10GHz) and low Df (0.0108 @ 10GHz)
Stable Dk/Df with different environment
Compatible with modified FR-4 processes
High thermal & CAF reliability
Property
|
Items |
Methods |
IT-170GLETC |
|
Tg (℃) |
TMA |
170 |
|
T-288 (w/ 1 Oz Cu, min) |
TMA |
>60 |
|
Td-5%(℃ ) |
TGA 5% loss |
380 |
|
CTE (ppm/℃) |
a1/a2 |
40/225 |
|
CTE (%), 50-260℃ |
TMA |
2.3 |
|
Dk @ 10 GHz (RC 75%) |
IPC TM-650 2.5.5.13 |
3.14 |
|
Df @ 10 GHz (RC 75%) |
IPC TM-650 2.5.5.13 |
0.0108 |
*The sample thickness : 0.76 mm