Goldman Sachs Securities’ Online Investor Conference

Date :2020/04/17

Place: Conference call

The Company will attend Goldman Sachs Securities’ online investor conference to discuss the company’s operational and financial results as provided on March 17, 2020.

ITEQ Corporation announces the launch of IT-8338A and IT-8350A: breakthrough FR4 products for use in Antenna and LNB applications

Hsinchu, Taiwan and Santa Clara, California, 10/17/2018 — ITEQ Corporation, a Taiwan based global leader in the development and manufacture of copper-clad laminates for printed circuit boards (PCBs), announced today the introduction of its new IT-8338A and IT-8350A products for use in Antenna and LNB applications.


IT-8338A, with a nominal dielectric constant of 3.38 +/-0.04 and a dissipation factor of 0.0038@ 10 GHz, is a product intended for LNB and antenna applications.
IT-8350A, with a nominal dielectric constant of 3.50 +/- 0.04 and a dissipation factor of 0.004 @ 10 GHz, is the next generation product for Antenna applications.
The above products are based on thermoset systems with Tg of 185
and Td higher than 360 .


The main advantage of these products over incumbent products is that these are FR4 products that deliver the best cost/performance ratio on the market.


The products offer excellent dimensional stability as a result of their thermoset make up:

  • IT-8338A and IT-8350A offer very stable DK/Df with temperature and humidity: TCDK is ~35 ppm/.
  • The IT-8338A and IT-8350A products are not prone to oxidation and issues related to thermal aging that are common with the incumbent products.
  • A full prepreg offering is available.
  • These products are highly suitable for hybrids and also offer the ability to make pure package high layer-count boards due to a full prepreg offering. The fabrication process is much simpler and more user-friendly compared to the incumbent products, and offers higher yields, better drillability, and superior registration, all at a lower cost of ownership.
  • RTF and HTE copper options are standard and Rz2 and Rz1 (Surface roughness <2 and <1 micrometer, respectively) copper options are also available. One major advantage with these products is the option to use very low profile (VLP) copper for reduced insertion loss and PIM.

The laminate offering includes 20, 30, and 60 mil thick laminates as well as optional thinner laminates as required for multilayer applications.
These products will be manufactured in ITEQ’s facility in Taiwan and distributed globally and are available for sampling and building test vehicles with customers. The data sheets for these products are available at
www.iteq.com.tw.

 

About ITEQ Corporation
Based in Hsinchu, Taiwan since its founding in 1997, ITEQ Corporation is a global leader in the development and manufacture of copper clad laminate materials used for printed circuit boards (PCBs).
The company has always been committed to developing the highest quality and most reliable laminate material products, through dedicated and focused cutting-edge research and development and state-ofthe-art manufacturing facilities and methods. ITEQ has grown to become one of the largest manufacturers of copper clad laminates and its products are used for advanced multilayer printed circuit boards that go into a wide range of applications, including automotive, aerospace, servers, storage, mobile phones, communications, and other electronic equipment. For more information about ITEQ please visit 
www.iteq.com.tw

Contacts:

Mike.Miller@iteq.com.tw
Allen.Shen@iteq.com.tw

ITEQ (huangjiang) Corporation Completed Environmental Protection Acceptance Monitoring Report

ITEQ (huangjiang) Corporation Completed Environmental Protection Acceptance Monitoring Report-1

 

ITEQ (huangjiang) Corporation Completed Environmental Protection Acceptance Monitoring Report-2

ITEQ Corporation is invited to join a roadshow of “Taiwan Corporate Day” on 13th – 14th Nov. 2017, holding by Taiwan Stock Exchange & JP Morgan Securities.

ITEQ Corporation is invited to join a roadshow of “Taiwan Corporate Day” on 13th – 14th Nov. 2017, holding by Taiwan Stock Exchange & JP Morgan Securities.

ITEQ Corporation Announces Launch of Halogen-free IT-8350G and IT-8338G For use in 24 GHz and 76-81 GHz automotive radar systems, millimeter wave applications, antennas, and 5G base station applications

Hsinchu, Taiwan and Santa Clara, California, 10/17/2017 — ITEQ Corporation, a Taiwan-based global leader in
the development and manufacture of copper-clad laminates for printed circuit boards (PCBs), announced
today the introduction of its new halogen free IT-8350G and IT-8338G products for use in a range of RF
applications.
IT-8350G, with a nominal dielectric constant of 3.50 +/-0.04, is the next generation halogen free product for
legacy base stations, power amplifiers, 24 GHz automotive radar applications, 77 GHz short-range and
medium-range radar systems, 5 G base stations and mm wave applications, direct broadcast systems, and a
number of antenna applications.
IT-8338G, with a nominal dielectric constant of 3.38 +/- 0.04. is the next generation halogen free product for
base stations, power amplifiers, LNBs (low noise block down converters) for direct broadcast systems and
antenna applications.
These products are built using Thermoset resins. The products have a Tg around 200°C and a decomposition
temperature (Td) in excess of 405°C.
The main advantages of these products over incumbent products are lower loss and halogen free composition
with dissipation factor around ~0.0024 at 10 GHz.
• The products offer excellent dimensional stability as a result of their thermoset make up.
• These products offer very stable DK/Df with temperature and humidity.
• One of the main advantages is the use of very low profile copper for reduced insertion loss. With the
use of special copper and reduced insertion loss, the effects of passive inter modulation (PIM) are
significantly alleviated.
• The products are not prone to oxidation and thermal aging related issues common with the incumbent
products.
• These products are highly suitable for hybrids and also offer the ability to make pure package high
layer count boards as a result of full prepreg offering. The fabrication process is much simpler and user
friendly compared to the incumbent products offering higher yields, better drillability, registration, and
a lower cost of ownership.
The laminate offering includes 10, 20, 30 & 60 mil thick laminates as well as thinner laminates required for
multilayer applications. The products will be manufactured in ITEQ’s state-of-the-art facility in Taiwan and
distributed globally.
FOR IMMEDIATE RELEASE
Contacts: Mike.Miller@iteq.com.tw
Jim.Lai@iteq.com.tw
ITEQ Corporation Announces Launch of Halogen-free IT-8350G and IT-8338G
For use in 24 GHz and 76-81 GHz automotive radar systems, millimeter wave applications,
antennas, and 5G base station applications
Tarun Amla, Chief Technology Officer and EVP, noted, “With the introduction of IT-8350G and IT-8338G, ITEQ
has filled the availability gap in RF halogen free space with next generation products where halogen free
product mandate is increasing rapidly. Our customers will find these ITEQ products address gaps in elevated
temperature aging performance, manufacturability, cost and availability with the existing halogenated
products.”
The products are available for sampling and building test vehicles with customers. The data sheets for these
products are available at www.iteq.com.tw

Contacts:

Luc.beauviller@iteq.com.tw

Jim.lai@iteq.com.tw

ITEQ Corporation Announces the launch of halogen-free IT-88GMW for use in 76-81 GHz Automotive Radar systems, emerging millimeter wave applications and 5G base station applications

Hsinchu, Taiwan and Santa Clara, California, 7/25/2017 — ITEQ Corporation, a Taiwan based global leader in the development and manufacture of copper-clad laminates for printed circuit boards (PCBs), announced today the introduction of its new halogen free IT-88GMW product for use in Automotive Radar, millimeter wave applications and emerging 5G applications. The product has a nominal dielectric constant of 2.98 and a dissipation factor 0.0012 at 10 GHz, making it the lowest loss product in this category of thermoset products. The product will be available as a standalone copper clad laminate in hybrid applications for use in automotive driver assist systems as well as with a full complement of prepreg materials for enabling high layer count boards. The product is suitable for high layer count backplane applications, as it offers very low skew and very low loss. The Glass transition temperature is in excess of 170° C and has a decomposition temperature of around 405° C. Copper profile with Rz values ~2 micrometers will be used as standard on the product.

The product will be manufactured in ITEQ’s state of the art facility in Taiwan and distributed globally.

Tarun Amla, Chief Technology Officer and EVP, noted, “IT-88GMW is a solution to various problems that customers and OEMs encounter when dealing with the incumbent PTFE type products. IT-88GMW solves dimensional stability problems by offering very low and consistent movement. Additionally, its thermomechanical properties closely match the materials that are used to build hybrid boards in automotive radar and other similar applications. PTFE properties have almost an order of magnitude difference in modulus compared to the FR4 materials that it is bonded with in hybrid boards, leading to multiple problems, such as deformation, delamination, and low yields. The extremely low loss and high thermal conductivity of our product and its ability to make pure package, high layer count boards is a breakthrough improvement over incumbent products. Further, due to its compatibility with FR4 type materials, this can generate more robust hybrid boards than competitive products, suitable for the demanding automotive reliability requirements. There has been a need in the market for dimensionally stable products compatible with the FR4 hybrids, while at the same time enabling pure package, high layer count boards using conventional PCB manufacturing technology. IT-88MWR is another product in a series of first to market products that promises low cost solutions for microwave as well as ultrahigh speed digital backplanes.”

The product is available for sampling and building Test Vehicles with customers.

About ITEQ Corporation
Based in Hsinchu, Taiwan since its founding in 1997, ITEQ Corporation is a global leader in the development and manufacture of copper clad laminate materials used for printed circuit boards (PCBs). The company has always been committed to developing the highest quality and most reliable laminate material products, through dedicated and focused cutting-edge research and development and state-of-the-art manufacturing facilities and methods. ITEQ has grown to become one of the largest manufacturers of copper clad laminates and its products are used for advanced multilayer printed circuit boards that go into a wide range of applications, including automotive, aerospace, servers, storage, mobile phones, communications, and other electronic equipment.

Contacts:

Luc.beauviller@iteq.com.tw

Jim.lai@iteq.com.tw

ITEQ Corporation Announces the Launch of IT-988G Ultra Low-Loss Halogen-Free Product for Channel Data Rates Beyond 56Gbps

HSINCHU, TAIWAN AND SANTA CLARA, CALIFORNIA, June 19, 2017 — ITEQ Corporation, a Taiwan-based global leader in the development and manufacture of copper-clad laminates for printed circuit boards (PCBs), announced today the introduction of its next generation halogen-free low-loss product for ultrahigh-speed signal transmission. The product is available in two formats, as IT-988G with E-Glass, and IT-988GSE with low Dk Glass. At 28 Ghz, the typical Dk and DF for IT-988G (at 60% resin content) are 3.46 and 0.0025, respectively, while the typical Dk and DF for IT-988GSE are 3.28 and 0.0016, respectively. Both products will be available with ultralow profile copper. The glass transition temperature is in excess of 230° C and the product has very low expansion at ~2.5% (50-260° C range). Initial signal integrity tests on industry standard test vehicles show a 38 -50% lower insertion loss in a side-by-side comparison to incumbent competitive products with similar glass and copper.

Tarun Amla, Chief Technology Officer and EVP, noted, “IT-988G and IT-988GSE are first mover products that promise to enable higher than 56 Gbps per channel. This ultralow-loss product provides the market with a great option for building the high transmission rate technologies of the future. The attributes have been carefully tailored to make sure that the products can be seamlessly adopted into existing processes and platforms. It is our endeavor at ITEQ to be first to market with the best-in-class products and this is the latest manifestation of that philosophy.”

The product will be manufactured in ITEQ’s state-of-the-art facility in Taiwan and distributed globally. It is available for signal integrity sampling and building test vehicles with customers.

###

About ITEQ Corporation

Based in Hsinchu, Taiwan since its founding in 1997, ITEQ Coproration is a global leader in the development and manufacture of copper-clad laminate materials used for printed circuit boards (PCBs). The company has always been committed to developing the highest quality and most reliable laminate material products, through dedicated and focused cutting-edge research and development and state-of-the-art manufacturing facilities and methods. ITEQ has grown to become one of the largest manufacturers of copper-clad laminates and its products are used for advanced multilayer printed circuit boards that go into a wide range of applications, including automotive, aerospace, servers, storage, mobile phones, communications, and other electronic equipment.

FOR IMMEDIATE RELEASE Contact:

Jim.lai@iteq.com.tw

Luc.beauviller@iteq.com.tw

Announcement of ITEQ board members for New Magagement Position: Executive Vice President , Chief Technology Officer, and President of ITEQ North America

  1. Public announcement date :2017/03/09
  2. Name and experience for former Chief Technology Officer   : none
  3. Name and experience for new Chief Technology Officer :
  4. Tarun Amla / Executive Vice President , Chief Technology Officer, and President of ITEQ North America
    Shengyi Technology Co. Ltd./ Chief Technology Officer & Senior Vice President(2016/3~2017/2)
    Isola Group / Chief Technology Officer & Executive Vice President
    Vice President, Operations & Technology
    Vice President, Marketing & Technology(1999/12~2015/10)
    Allied Signal Laminate Systems / Director Operations, Singapore & Country Manager, India(1996/4~1999/12)
  5. Personnel change notice: New officer
  6. The reasons of personnel change  :
    In order to meet company’s goal to enhance ITEQ capability of product efficiency and high end material development for next generation. ITEQ  hereby appoints Mr. Tarun Amla to act as Chief Technology Officerto integrate product research、marketing 、manufacturing and quality upgrade .
  7. Effective date:2017/03/09