IT-8338G
IT-8338G
IT-8338G 是一种高阶Ultra-Low Loss (ULL) & High Tg (185°C by TMA)材料用于高要求射频(RF)应用。这支材料拥有介电常数(Dk) 3.38 被设计用于5G基地台mmWave应用，功率放大器、天线、76-81 GHz汽车雷达及其他RF应用。这支产品提供比纤维增强碳氢化合物材料较佳的耗散因子和插入损失。这个产品可搭配全整PP用于高信赖性多层板或和其他ITEQ材料混压。
下一世代无卤产品应用
5G 基地台& mmWave应用
功率放大器、天线应用
76-81 GHz汽车雷达
重要特性
Low Dk 3.38 at 10 GHz & Low Df 0.0023 at 10 GHz
Excellent dimensional stability
Very stable DK/Df with Temperature
Ability to use very low profile Copper for reduced insertion loss
Highly suitable for Hybrids, Ability to make high layer count boards
Full prepreg offering, Compatible with modified FR-4 processes
性能
| Items | Methods | IT-8338G |
| Tg (℃) | TMA | 185 |
| T288 (with 1 oz Cu), min | TMA | >60 |
| Td-5 %( ℃) | TGA | 430 |
| CTE (ppm/℃) | a1/a2 | 60/350 |
| CTE (%), 50-260℃ | TMA | 3.4 |
| Dk @ 10 GHz | TM-mode,CDR C-24/23/50 | 3.38 |
| Df @ 10 GHz | TM-mode,CDR C-24/23/50 | 0.0023 |
*样品厚度 : 0.508 mm
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IT-8350G
IT-8350G
IT-8350G是一种高阶High Tg (185°C by TMA) Ultra-Low Loss (ULL)材料可用于高要求(RF)应用。这支材料拥有介电常数(Dk) 3.48被设计用于5G基地台, mmWave 应用、功率放大器、天线、76-81 GHz汽车雷达和RF应用。这支产品提供比增强碳氢化合物材料较佳的耗散因子和插入损失。这个产品可搭配全整PP用于高信赖性多层板或和其他ITEQ材料混压。
下一世代无卤产品应用
5G基地台& mmWave应用
功率放大器、天线应用
76-81 GHz汽车雷达
重要特性
Low Dk 3.48 at 10 GHz & Low Df 0.0025 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids, ability to make high layer count boards
Full Prepreg offering, compatible with modified FR-4 processes
性能
| Items | Methods | IT-8350G |
| Tg (℃) | TMA | 185 |
| T288 (with 1 oz Cu), min | TMA | >60 |
| Td-5 %( ℃) | TGA | 430 |
| CTE (ppm/℃) | a1/a2 | 55/290 |
| CTE (%), 50-260℃ | TMA | 2.8 |
| Dk @ 10 GHz | TM-mode,CDR C-24/23/50 | 3.48 |
| Df @ 10 GHz | TM-mode,CDR C-24/23/50 | 0.0025 |
*样品厚度 : 0.508 mm
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IT-88GMW
IT-88GMW
IT-88GMW是一种高阶Ultra-Low Loss (ULL) & High Tg (185°C by TMA)材料用于高要求射频(RF)应用。该材料设计用于在 76-81 GHz 频率范围内运行的自动驾驶或高级驾驶辅助系统 (ADAS) 的远程 (LRR)、短程 (SRR) 和中程雷达 (MRR)。该产品提供与 PTFE 产品相同的损耗因子和插入损耗。其较高的弹性模量有助于减少混合应用中的mismatch。此产品被预计在毫米波频率范围内工作，并且需要高功率处理能力，适用于高要求5G基地台、功率放大器及天线应用。该产品可以与完整的 Prepre 产品配对，以构建高可靠性的板板。介电性能随温度变化非常稳定，因此非常适合汽车领域热循环要求。
下一世代无卤产品应用
5G 基地台& mmWave应用
功率放大器
天线应用
76-81 GHz汽车雷达
点对点微波链结
航天应用
重要特性
Low Dk 3.02 at 10 GHz & Low Df 0.0013 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids, ability to make high layer count boards
Full Prepreg offering, compatible with modified FR-4 processes
性能
| Items | Methods | IT-88GMW |
| Tg (℃) | TMA | 185 |
| T288 (with 1 oz Cu), min | TMA | >60 |
| Td-5 %( ℃ ) | TGA | 425 |
| CTE (ppm/℃) | a1/a2 | 70/400 |
| CTE (%), 50-260℃ | TMA | 3.9 |
| Dk @ 10 GHz | TM-mode,CDR C-24/23/50 | 3.02 |
| Df @ 10 GHz | TM-mode,CDR C-24/23/50 | 0.0013 |
*样品厚度 : 0.508 mm
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IT-8350B
IT-8350B
IT-8350B是一种高阶Ultra-Low Loss (ULL)材料可用于高要求的(RF)应用。这支材料拥有介电常数(Dk) 3.49被设计用于5G基地台, mmWave 应用、功率放大器、天线、76-81 GHz汽车雷达和RF应用。这支产品提供纤维比增强碳氢化合物材料较佳的耗散因子和插入损失。
应用
5G 基地台& mmWave应用
功率放大器、天线应用
76-81 GHz汽车雷达
重要特性
Low Dk 3.49 at 10 GHz & Low Df 0.0025 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids, ability to make high layer count boards
性能
| Items | Methods | IT-8350B |
| T288 (with 1 oz Cu), min | TMA | >60 |
| Td-5 %( ℃ ) | TGA | 400 |
| CTE (ppm/℃) | a1/a2 | 60/180 |
| CTE (%), 50-260℃ | TMA | 2.3 |
| Dk @ 10 GHz | TM-mode, CDR C-24/23/50 | 3.49 |
| Df @ 10 GHz | TM-mode, CDR C-24/23/50 | 0.0025 |
*样品厚度 : 0.762 mm
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IT-8350T
IT-8350T
IT-8350T是一種Ultra-Low Loss (ULL)材料。這支材料具有高熱傳導係數，被設計用於高功率及要求更高的最高工作溫度的工業加熱應用。
應用
高功率射频和微波功率放大器
应用于工业加热的高功率放大器
无元原件:例如耦合器、滤波器及功率分配器
重要特性
Low Dk 3.51 at 10 GHz & Low Df 0.0017 at 10 GHz
Very stable Dk/Df with temperature
Excellent dimensional stability
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids, ability to make high layer count boards
性能
| Items | Methods | IT-8350T |
| T288 (with 1 oz Cu), min | TMA | >60 |
| Td-5 %( ℃ ) | TGA | 380 |
| Thermal Conductivity (W/mK) | ASTM D5470 | 0.9 |
| CTE (%), 50-260℃ | TMA | 2.0 |
| Dk @ 10 GHz | TM-mode, CDR C-24/23/50 | 3.51 |
| Df @ 10 GHz | TM-mode, CDR C-24/23/50 | 0.0017 |
*样品厚度 : 0.762 mm
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IT-8300GA
IT-8300GA
IT-8300GA是一种高阶Ultra-Low Loss(ULL)&High Tg(200°C by TMA)材料用于高要求射频(RF)应用。这支材料拥有介电常数(Dk) 3.00被设计用于5G基地台、mmWave应用、天线及其他RF应用。这支产品提供比纤维增强碳氢化合物材料较佳的耗散因子和插入损失。这个产品可搭配全整PP用于高信赖性多层板或和其他ITEQ材料混压。
下一世代无卤产品应用
5G基地台& mmWave应用
天线应用
重要特性
Low Dk 3.00 at 10 GHz & Low Df 0.0026 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids, ability to make high layer count boards
Full Prepreg offering, compatible with modified FR-4 processes
性能
| Items | Methods | IT-8300GA |
| Tg (℃) | TMA | 200 |
| T288 (with 1 oz Cu), min | TMA | >60 |
| Td-5%(℃) | TGA | 430 |
| CTE (ppm/℃) | a1/a2 | 40/140 |
| CTE (%), 50-260℃ | TMA | 1.7 |
| Dk @ 10 GHz | TM-mode,CDR C-24/23/50 | 3.0 |
| Df @ 10 GHz | TM-mode,CDR C-24/23/50 | 0.0026 |
*样品厚度 : 0.508 mm
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IT-8615G
IT-8615G
IT-8615G 是一种高阶High Tg (205°C by TMA) Ultra-Low Loss (ULL)材料可用于高要求(RF)应用。这支材料拥有介电常数(Dk)6.15被设计用于5G基地台, mmWave 应用、天线和其他RF应用。这支产品提供比增强碳氢化合物材料较佳的耗散因子和插入损失。这个产品可搭配全整PP用于高信赖性多层板或和其他ITEQ材料混压。
下一世代无卤产品应用
5G基地台& mmWave应用
天线应用
重要特性
High Dk 6.14 at 10 GHz & Low Df 0.0038 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for hybrids
Ability to make high layer count boards
Full Prepreg offering, compatible with modified FR-4 processes
性能
| Items | Methods | IT-8615G |
| Tg (℃) | TMA | 205 |
| T288 (with 1 oz Cu), min | TMA | >60 |
| Td-5%(℃) | TGA | 430 |
| CTE (ppm/℃) | a1/a2 | 45/220 |
| CTE (%), 50-260℃ | TMA | 1.9 |
| Dk @ 10 GHz | TM-mode,CDR C-24/23/50 | 6.14 |
| Df @ 10 GHz | TM-mode,CDR C-24/23/50 | 0.0038 |
*样品厚度 : 0.508 mm
| PDF Download |