IT-140
IT-140 is a multi-functional epoxy and Dicy cured with AOI and UV blocking resin system. Suitable for consumer application.
Application
PC and Notebook
Memory Module
Game Player
Consumer and Multilayer PCB
Key Features
Heat resistance
Excellent CAF resistance
Good through-hole reliability
Property
Items |
Methods |
IT-140 |
Tg (℃) |
DSC |
140 |
T-288 (w/ 1oz Cu, min) |
TMA |
2 |
Td-5%(℃ ) |
TGA 5% loss |
305 |
CTE (ppm/℃) |
a1/a2 |
55/290 |
CTE (%), 50-260℃ |
TMA |
4.2 |
Peel strength (lb/inch) |
1oz |
11 |
Water absorption |
D-24/23 |
0.10 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.0 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.018 |
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IT-180GN
IT-180G no/low flow prepreg is a halogen free medium Tg (>170℃ by DSC) multifunctional epoxy. It’s designed for rigid flex board and heat sink bonding application.
Application
Rigid Flex Board
Key Features
Halogen-Free, Phosphorous-containing Epoxy Prepreg
Superior bonding strength to bonding sheet prepreg
Low powder for punching processing
Minimal and uniform flow performance
Good thickness uniformity and flatness
Property
Items |
Methods |
IT-180GN |
Tg (℃) |
DSC |
175 |
T-288 (w/ 1oz Cu, min) |
TMA |
– |
Td-5%(℃ ) |
TGA 5% loss |
365 |
CTE (ppm/℃) |
a1/a2 |
– |
CTE (%), 50-260℃ |
TMA |
– |
Peel strength (lb/inch) |
1oz |
9 |
Peel strength (lb/inch) |
PI Base |
9.5 |
Water absorption |
D-24/23 |
0.10 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.0 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.016 |
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IT-158
IT-158 is a medium Tg (>150℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various application and can pass 260℃ lead free assembly.
Application
Automotive (Engine room ECU)
Multilayer and HDI PCB
PC and Notebook
Memory Module
Game Player
Server and Networking
Telecommunications
Heavy Copper
Key Features
Low CTE
High heat resistance
Excellent CAF resistance
Good through-hole reliability
Property
Items |
Methods |
IT-158 |
Tg (℃) |
DSC |
155 |
T-288 (w/ 1oz Cu, min) |
TMA |
30+ |
Td-5%(℃ ) |
TGA 5% loss |
345+ |
CTE (ppm/℃) |
a1/a2 |
40/240 |
CTE (%), 50-260℃ |
TMA |
3.3 |
Peel strength (lb/inch) |
1oz |
8+ |
Water absorption |
D-24/23 |
0.08 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.0 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.018 |
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IT-180A
IT-180A is an advanced high Tg (170℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various application and can pass 260℃ lead free assembly.
Application
Automotive (Engine room ECU)
Multilayer and HDI PCB
Backplanes
Data Storage
Server and Networking
Telecommunications
Heavy Copper
Key Features
Low CTE
High heat resistance
Excellent CAF resistance
Good through-hole reliability
Property
Items |
Methods |
IT-180A |
Tg (℃) |
DSC |
175 |
T-288 (w/ 1oz Cu, min) |
TMA |
30+ |
Td-5%(℃ ) |
TGA 5% loss |
345+ |
CTE (ppm/℃) |
a1/a2 |
45/210 |
CTE (%), 50-260℃ |
TMA |
2.7 |
Peel strength (lb/inch) |
1oz |
8+ |
Water absorption |
D-24/23 |
0.12 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.1 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.016 |
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IT-180I
IT-180I is a standard loss, high Tg (175℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability. It is designed for high layer count PCB and it can pass 260℃ Lead free assembly process.
Application
Multilayer and High Layer count PCB
Backplanes
Server and Networking
Telecommunications
Key Features
Excellent CAF resistance
Low CTE & Standard Loss performance
Lead Free , High Tg and high thermal reliability
For high layer count PCB applications
Property
Items |
Methods |
IT-180I |
Tg (℃) |
DSC |
175 |
T-288 (w/ 1oz Cu, min) |
TMA |
>30 |
Td-5%(℃ ) |
TGA 5% loss |
350 |
CTE (ppm/℃) |
a1/a2 |
40/210 |
CTE (%), 50-260℃ |
TMA |
2.3 |
Peel strength (lb/inch) |
1oz |
8 |
Water absorption |
D-24/23 |
0.12 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.0 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.015 |
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IT-180
IT-180 is an advanced high Tg (170℃ by DSC) multifunctional epoxy based with high thermal reliability and CAF resistance. It’s suitable for various application and can pass 260℃ lead free assembly.
Application
Automotive
Multilayer and High Layer PCB
Backplanes
Data Storage
Server and Networking
Telecommunications
Heavy Copper
Key Features
High heat resistance
Excellent CAF resistance
Good through-hole reliability
Property
Items |
Methods |
IT-180 |
Tg (℃) |
DSC |
175 |
T-288 (w/ 1oz Cu, min) |
TMA |
20 |
Td-5%(℃ ) |
TGA 5% loss |
350 |
CTE (ppm/℃) |
a1/a2 |
50/250 |
CTE (%), 50-260℃ |
TMA |
3.0 |
Peel strength (lb/inch) |
1oz |
8 |
Water absorption |
D-24/23 |
0.12 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.0 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.020 |