IT-168G1
The IT-168G1 is an advanced HDI application, Mid Tg (150° C by DSC) and low Dk material. This material is designed for high any layer application and easily for thin core the impendence resistance control of the PWBs, Also for high layer PCB application, like the handheld drive & smart phone, tablet application. Due to the low Dk respectively can stable with high frequency, it is also suitable for halogen free application. IT-168G1 also exhibit high thermal resistant and CAF reliability.
Application
Smart phone
Tablet
Hand held drive
Ultra book, Pad
Key Features
For LTE, 4G and 5G hand phone solution
Advanced High heat resistance and low Dk Technology
Lower Dk (‹3.5 @ 10GHz) and low Df (about 0.1 @ 10GHz)
Stable Dk/Df with different environment
Compatible with modified FR-4 processes
High thermal & CAF reliability
Property
Items |
Methods |
IT-168G1 |
Tg (℃) |
DSC |
150 |
T-288 (w/ 1 Oz Cu, min) |
TMA |
60+ |
Td-5%(℃ ) |
TGA 5% loss |
380+ |
CTE (ppm/℃) |
a1/a2 |
40/230 |
CTE (%), 50-260℃ |
TMA |
3.0 |
Peel strength (lb/inch) |
1 oz |
6 |
Water absorption |
IPC TM-650 2.6.2.1 |
< 0.12 |
Dk @ 10 GHz (RC 75%) |
IPC TM-650 2.5.5.13 |
< 3.5 |
Df @ 10 GHz (RC 75%) |
IPC TM-650 2.5.5.13 |
< 0.01 |
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IT-168G2
The IT-168G2 is an advanced HDI application, Mid Tg (150° C by TMA) and low Dk material. This material is designed for high any layer application and easily for thin core the impendence resistance control of the PWBs, Also for high layer PCB application, like the handheld drive & smart phone, tablet application. Due to the low Dk respectively can stable with high frequency, it is also suitable for halogen free application. IT-168G2 also exhibit high thermal resistant and CAF reliability.
Application
Smart phone
Tablet
Hand held drive
Ultra book, Pad
Key Features
For LTE, 4G and 5G hand phone solution
Advanced High heat resistance and low Dk Technology
Lower Dk (‹3.5 @ 10GHz) and low Df (‹0.008 @ 10GHz)
Stable Dk/Df with different environment
Compatible with modified FR-4 processes
High thermal & CAF reliability
Property
Items |
Methods |
IT-168G2 |
Tg (℃) |
TMA |
150 |
T-288 (w/ 1 Oz Cu, min) |
TMA |
60+ |
Td-5%(℃ ) |
TGA 5% loss |
380+ |
CTE (ppm/℃) |
a1/a2 |
45/210 |
CTE (%), 50-260℃ |
TMA |
3.0 |
Peel strength (lb/inch) |
1 oz |
6 |
Water absorption |
D-24/23 |
< 0.12 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
3.5 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.008 |
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IT-150G
The IT-150G is an general HDI application, Mid Tg (150° C by DSC) and Halogen free material. This material is designed for any layer application and easily for thin core application PWBs, Also for high layer PCB application, like the handheld drive & smart phone, tablet application. Due to the Halogen free material can be achieve of environmental protection regulations, it is also suitable for exhibit high thermal resistant and CAF reliability.
Application
Smart phone
Tablet
Hand held drive
Ultra book, Pad
Consumers
Key Features
For HDI and hand phone solution
Advanced High heat resistance
General Dk (4.1 @ 1GHz) and Df (0.011 @ 1GHz)
Inconformity with environmental protection regulations
Compatible with modified FR-4 processes
High thermal & CAF reliability
Property
Items |
Methods |
IT-150G |
Tg (℃) |
TMA |
150 |
T-288 (w/ 1 Oz Cu, min) |
TMA |
60+ |
Td-5%(℃ ) |
TGA 5% loss |
365 |
CTE (ppm/℃) |
a1/a2 |
35/230 |
CTE (%), 50-260℃ |
TMA |
2.8 |
Peel strength (lb/inch) |
1 oz |
6 |
Water absorption |
D-24/23 |
< 0.12 |
Dk @ 1 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.1 |
Df @ 1 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.011 |
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IT-170GLE
The IT-170GLE is an advanced HDI application, high Tg (170° C by TMA) and low Dk material. This material is designed for High storage modulus application and future any layer PWBs, Also for high layer PCB application, like the handheld drive & smart phone, modify BGA board application. Due to the low Dk respectively can stable with high frequency, it is also suitable for halogen free application. IT-170GLE also exhibit high thermal resistant and CAF reliability.
Application
Smart phone
Tablet
Hand held drive
Like BGA board
Key Features
For LTE, 4G and 5G hand phone solution
Advanced High heat resistance and low CTE Technology
Lower Dk (‹3.5 @ 10GHz) and low Df (‹0.008 @ 10GHz)
Stable Dk/Df with different environment
Compatible with modified FR-4 processes
High thermal & CAF reliability
Property
Items |
Methods |
IT-170GLE |
Tg (℃) |
TMA |
170 |
T-288 (w/ 1 Oz Cu, min) |
TMA |
60+ |
Td-5%(℃ ) |
TGA 5% loss |
380+ |
CTE (ppm/℃) |
a1/a2 |
43/223 |
CTE (%), 50-260℃ |
TMA |
2.4 |
Peel strength (lb/inch) |
1 oz |
6 |
Water absorption |
D-24/23 |
< 0.1 |
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
3.5 |
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.008 |